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AT25080B/160B
8X – TSSOP
C
Pin 1 indicator
this corner
E1
E
H
L
L1
Top View
b
A
End View
A1
COMMON DIMENSIONS
e
A2
(Unit of Measure = mm)
D
Side View
SYMBOL
A
A1
MIN
-
0.05
NOM
-
-
MAX
1.20
0.15
NOTE
Notes:
1. This drawing is for general information only. Refer to JEDEC
Drawing MO-153, Variation AA, for proper dimensions,
A2
0.80
1.00
1.05
tolerances, datums, etc.
D
2.90
3.00
3.10
2, 5
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
E
6.40 BSC
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25 mm
E1
b
4.30
0.19
4.40
–
4.50
0.30
3, 5
4
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable
e
0.65 BSC
Dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
L
L1
C
0.45
0.09
0.60
1.00 REF
-
0.75
0.20
5. Dimension D and E1 to be determined at Datum Plane H.
12/8/11
TITLE
Package Drawing Contact: 8X, 8-lead 4.4mm Body, Plastic Thin
packagedrawings@atmel.com Shrink Small Outline Package (TSSOP)
GPC
TNR
DRAWING NO.
8X
REV.
E
21
5228E–SEEPR–3/12
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